The Best tool to complete the prototyping & testing for your computer or electronic circuits More interconnected tie points Better structure More binding posts & power bus. Easy combination & Expansion Easy insertion & wiring. Very flexible for digital & analog circuits 1.6 interconnected round tie points per Row in horizantal array is to provide an ideal placement and more tie points for MSi,LSI and all DIP size chpis in "CPU BUS" 2.POWER BUS 2 of 24 each of conitnual interconnected tie points with black line printing. 4 of 12 each of continual interconnected tie points with RED line printing & V1, V2, V3, V4marking individually 3.6 interconnected round tie points per column in vertical array is to provide an ideal placement and wiring for NOP-DIP size components 4.Power Block, provided 5 individual interconnected Banana/pin Jack adaptors for easy connectionof power Bus.(Accept 4.5 mm Y-Terminal . Stripped wire and 4mm Banana plug.) 5.Interconnected "Round" tie points make your wiring easier. Accept solid wires fro, AWG # 22-30 (0.3-0.8mm). 6.Vertical combination will enable you to get More wiring space for DIP size components. 7.The IC chips can be mounted between two AD Breadboards when they are combined.

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